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dvanced Circuits has led the PCB industry for over 25 years, providing some of the most innovative printed circuit board technologies                
               and highest quality standards found in the industry today.  You can count on us to cater to your specific needs, from the simplest                
               boards to the most complex designs for small quantity and large scale production.

Please see our ordering options below...

Items

Capabilities(Delivery    area    <5m2)

Capabilities(Delivery    area    ≥5m2)

Material

Normal FR4

Shengyi S1141(Not recommend it to lead    free assembly process)

Shengyi S1141(Not recommend it to No-Pb    assembly process)

Normal Tg FR4(Halogen free)

Shengyi S1155

Shengyi S1155

 

High Tg FR4(Halogen free)

Shengyi S1165

Shengyi S1165

 

HDI PCB material

LDPP(IT-180A 1037&1086)、Normal PP 106&1080

LDPP(IT-180A 1037&1086)、Normal PP 106&1080

 

Hight CTI

Shengyi S1600

Shengyi S1600

 

High Tg FR4

FR408、FR408HR、IS410、FR406、GETEK、PCL-370HR;IT180A、IT-150DA;N4000-13、N4000-13EP、N4000-13SI、N4000-13EP SI;Megtron 4、Megtron 6(Panasonic);EM-827(Elite);GA-170(Grace Electron );NP-180(Nanya);TU-752、TU-662(Taiwan Union);MCL-BE-67G(H)、MCL-E-679(W)、MCL-E-679F(J)(Hitachi);VT-47(Ventec)

IT180A、GETEK、PCL-370HR、N4000-13、N4000-13EP、N4000-13SI、N4000-13EP SI

 

Ceramic Particle Filled    Laminates

Rogers4350、Rogers4003、25FR、25N

Rogers4350、Rogers4003、25FR、25N

 

PTFE Laminates

Rogers series、Taconic series、Arlon series、Nelco series、Taizhou Wangling F4BK    series、TP series;

Taconic (TLX、TLF、TLY、RF、TLC、TLG series);Arlon(Diclad、AD series)

 

PTFE PP

Taconic TP series、TPG series、TPN series、HT1.5(1.5mil)、Fastrise series

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Hybrid laminating

Rogers/Taconic/Arlon/Nelco laminate with    FR-4 material(including partial    Ro4350B hybrid laminating with FR-4)

Rogers/Taconic/Arlon/Nelco laminate with    FR-4 material(including partial    Ro4350B hybrid laminating with FR-4)

 

PCB type

Rigid pcb

Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper    power PCB、Backdrill、Semiconductor Test products.

Backplane、HDI、High multi-layer blind&buried PCB、Backdrill

Buildings

Blind&buried via type

mechanical blind&burried vias with less than 3 times laminating

mechanical blind&burried vias with less than 2 times    laminating

HDI PCB

1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating

1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating

 

Finish treatment

Lead free

Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge

Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold fing

Leaded

Leaded HASL

Leaded HASL

 

aspect ratio

10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP)

10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP)

 

Max finished size

HASL Lead 22"*39";HASL Lead    free 22"*24";Flash gold 24"*24";Hard gold    24"*28";ENIG 21"*27";Flash gold(electroplated gold) 21"*48";Immersion Tin 16"*21";Immersion silver    16"*18";OSP 24"*40";

HASL Lead 22"*39";HASL Lead    free 22"*24";Flash gold 24"*24";Hard gold    24"*28";ENIG 21"*27";Flash gold(electroplated gold)    21"*48";Immersion Tin 16"*21";Immersion silver 16"*18";OSP 24"*40";

 

MIN finished size

HASL Lead 5"*6";HASL Lead    free 10"*10";Flash gold 12"*16";Hard gold    3"*3";Flash gold(electroplated    gold) 8"*10";Immersion Tin 2"*4";Immersion silver    2"*4";OSP 2"*2";

HASL Lead 5"*6";HASL Lead    free 10"*10";Flash gold 12"*16";Hard gold    3"*3";Flash gold(electroplated gold) 8"*10";Immersion Tin 2"*4";Immersion silver    2"*4";OSP 2"*2";

 

PCB thickness

HASL Lead 0.6-4.0mm;HASL Lead    free 0.6-4.0mm;Flash gold    1.0-3.2mm;Hard gold 0.1-5.0mm;ENIG 0.2-7.0mm;Flash gold(electroplated gold)    0.15-5.0mm;Immersion Tin 0.4-5.0mm;Immersion silver    0.4-5.0mm;OSP 0.2-6.0mm;

HASL Lead 0.6-4.0mm;HASL Lead    free 0.6-4.0mm;Flash gold    1.0-3.2mm;Hard gold 0.1-5.0mm;ENIG 0.2-7.0mm;Flash gold(electroplated gold)    0.15-5.0mm;Immersion Tin 0.4-5.0mm;Immersion silver 0.4-5.0mm;OSP 0.2-6.0mm;

 

MAX high to gold finger

1.5inch

1.5inch

 

Min space between gold fingers

6mil

8mil

 

Min block space    to gold fingers

7.5mil

7.5mil

 

Plating/coatin g thickness

Tin thickness

2-40μm (0.4μm on large tin    area of Leaded    HASL, 1.5μm on large tin    area of HASL    lead free)

2-40μm (0.4μm on large tin    area of Leaded    HASL, 1.5μm on large tin    area of HASL    lead free)

OSP

0.2-0.6μm

0.2-0.6μm

 

ENIG

Ni: 3-8μm; Au: 0.05-0.1μm

Ni: 3-8μm; Au: 0.05-0.1μm

 

Immersion Silver

0.2-0.4μm

0.2-0.4μm

 

Immersion Tin

≥1.0

≥1.0

 

Hard gold

0.1-4.0μm

0.1-2.0μm

 

Soft gold

0.1-4.0μm

0.1-4.0μm

 

ENEPIG

Ni: 3-8μm, Pd:0.05-0.15μm, Au: 0.05-0.1μm

Ni: 3-8μm, Pd:0.05-0.15μm, Au: 0.05-0.1μm

 

Flash gold(electroplated gold)

Ni:≥3μm ; Au: 0.025-0.1μm ;base copper≤1 oz

Ni:≥3μm ; Au: 0.025-0.1μm ;base copper≤1 oz

 

electroplated Gold finger

Ni:≥3μm ; Au: 0.25-1.5μm(The Thinnest point)

Ni:≥3μm ; Au: 0.25-1.5μm(The Thinnest point)

 

Carbon

10-50μm

10-50μm

 

Soldermask

0.4-0.7mil (on copper    area), 0.2-0.31mil(on via pad),≥0.2mil(on    circuits around the corner, just for one-time print and copper thickness<48um)

0.4-0.7mil (on copper    area), 0.2-0.31mil(on via pad),≥0.2mil(on    circuits around the corner, just for one-time print and copper thickness<48um)

 

Blue plastic

8--31.5mil

8--16mil